5 Must-Have Features in a Electronic Chemicals Manufacturer

A lack of standards means designers need to rely on vendor datasheets and enable out-of-the-box thinking.

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The additive manufacturing electronics (AME) industry is rapidly gaining momentum, with the market size projected to reach billions in the coming years as engineers and designers increasingly adopt this cutting-edge technology. Despite the growing use of technology, educational resources and design guidance for AME remain scarce, leaving many professionals to navigate uncharted territory. To bridge this gap, here are five essential tips every designer should know when creating electronic circuits using AME.

1. Material compatibility. It is essential for engineers to consult material datasheets early in the design process and adjust calculations accordingly. AME relies on materials that differ from those used in traditional PCB fabrication. Our signature machine utilizes silver nanoparticle ink for conductive elements such as traces and ground (GND) planes, coupled with an acrylate-based photopolymer for dielectric layers and structures, instead of relying on copper traces and fiberglass-reinforced laminates. These differences have important implications for both mechanical and electrical design.

Mechanically, traditional laminates offer high strength due to glass-fiber reinforcement. In contrast, AME photopolymers are composed entirely of polymer, making them inherently less rigid. Since most AME applications focus on electronic rather than mechanical performance, however, this is rarely a limitation, and designers can compensate for the reduced material strength by optimizing the part’s geometry. Compact, well-structured designs often exhibit excellent durability, even in demanding environments, thanks to favorable aspect ratios and the precision of micron-scale printing.

Electrically, the materials used in AME also exhibit different behavior. For example, the dielectric constant of our photopolymer is approximately 2.8, compared to the 3.8 to 4.4 range typical of FR-4 substrates. Consider the lower dielectric constant when designing for AME, where impedance control is required. Additionally, the 3-D capabilities of AME enable out-of-the-box thinking and the implementation of various transmission lines, such as embedded coaxial lines, which are difficult to fabricate using traditional manufacturing methods. These factors can significantly affect designs.

As the AME field evolves, a broader selection of materials will become available, offering greater flexibility in terms of dielectric constants, conductivity and mechanical performance. This will open new possibilities for designers seeking to push the boundaries of electronic circuit design (Figure 1).

Figure 1.

2. Populating boards. The thermal properties of AME support lower-temperature soldering processes. For example, the silver nanoparticle ink used in our systems permits solder reflow at around 200°C, compared to the 240°C typically required in traditional PCB assembly.

AME also introduces a unique capability beyond surface mounting: the ability to embed components directly within the printed structure. This is achieved by pausing the print mid-process, placing the component into a predesigned cavity, and then continuing the print to secure it and print its interconnect. This approach can eliminate the need for soldering or wire-bonding if the silicon die is placed altogether.

Embedding components requires a shift in design thinking, however. Instead of working in two dimensions, designers must consider the full three-dimensional structure of the circuit. This includes planning for internal cavities, vertical interconnects, and ensuring that embedded components can withstand the UV curing and thermal conditions of the printing process. For example, researchers at the Technical University of Liberec successfully embedded a thin ferromagnetic core into a 3-D-printed coil to create a fluxgate sensor using this method, resulting in superior performance. This approach achieved higher sensitivity and lower noise levels than otherwise would be possible, making it suitable for precise magnetic field measurements.

3. Following the design rules. While AME eliminates the need for traditional milling and drilling, it still requires adherence to specific design rules to ensure manufacturability and performance. These rules govern aspects such as trace width, spacing between conductive elements, and the geometry of embedded structures.

In traditional PCB fabrication, design constraints are largely dictated by the mechanical limitations of the manufacturing equipment. In AME, the constraints are defined by the resolution of the printing process and the behavior of the materials during the curing process. For example, we typically recommend a minimum trace width and spacing of 6 mils (0.006"). These values ensure reliable electrical performance and prevent issues such as short circuits or signal degradation.

Figure 2.

Designers also need to consider the integration of dielectric structures for placing components with mechanical holding, or passive electrical devices embedded onto the board. This includes capacitors, inductors and transmission lines for radio frequency (RF) applications, such as coaxial lines or waveguide structures. Regardless of the integrated element, each of these elements must be designed within the resolution limits of the printer and the electrical characteristics of the materials.

4. Optimizing print time. For AME, there are also best practices around placing the device on the printing tray, as good orientation is essential to optimize print time. Suboptimal placement will require more passes to build up each layer. The total height of the device also affects printing time, so the lower the profile, the faster the print, as layer thickness for the dielectric material is ~5-10µm, depending on the material in use, and ~1µm for the conductive material. Although this level of accuracy takes time to print, it enables highly accurate printing and designs that wouldn’t otherwise be possible, offering custom thicknesses, as opposed to traditional laminates, which come in specific thicknesses.

In AME, print time is influenced not only by the design complexity but also the part orientation on the print tray. Strategic placement can significantly reduce the number of passes required to build each layer, directly impacting overall production time. Orientation also plays a critical role. Aligning the design to minimize the number of print head movements can lead to more efficient builds.

The height of the printed object is a key factor. Since dielectric layers are deposited at 5 to 10µm per pass and conductive layers at just ~1µm, taller structures naturally take longer to fabricate. By minimizing the vertical profile where possible, designers can accelerate the build process without compromising functionality (Figure 3). By considering these factors early in the design phase, engineers can fully leverage of AME’s efficiency.

Figure 3.

5. Reliability, standardization and testing. Unlike traditional PCB manufacturing, AME currently operates without a unified set of industry standards. While organizations such as IPC are actively developing guidelines for additive electronics, designers today must take a more tailored approach to testing and validation.

In conventional PCB production, standard tests – such as thermal cycling, humidity exposure and vibration – are applied uniformly, regardless of the end application. These tests simulate long-term use and environmental stress, ensuring reliability across a wide range of conditions. In AME, however, the lack of standardized benchmarks means that testing must be customized to the specific use case of the printed device.

For example, thermal cycling from –20° to 120°C is common for evaluating electronic components. In AME, devices such as interposers, antennas or embedded connectors may pass without issue, while others may require design adjustments to meet performance expectations. The results can vary significantly depending on the design’s geometries.

As the AME ecosystem matures, the development of formal standards will simplify this process, enabling more consistent testing and certification. In the meantime, designers must remain proactive, defining test protocols based on the intended application and staying informed about emerging guidelines from industry bodies.

Putting AME into Practice

As additive manufacturing electronics continue to evolve, it offers designers unprecedented flexibility. Nevertheless, realizing the full potential of AME requires a solid understanding of its unique materials, design constraints and process considerations. By adapting design approaches and staying informed about emerging materials, technologies and standards, engineers can confidently leverage AME to create innovative, high-performance electronic systems that go beyond the limitations of traditional manufacturing.

Amir Shelef is application engineering director, AME, at Nano Dimension (nano-di.com), a provider of micro-3D printing/additive manufacturing (AM) solutions for a diverse array of applications spanning industry sectors such as medical, aerospace, automotive, consumer, electronics, optics and semiconductors; This address is being protected from spambots. You need JavaScript enabled to view it. .

Counterfeit electronic components pose a significant risk to various industries across the globe. These fake parts affect almost all sectors, including medical, automotive, consumer goods, networking, communication, space, and defense.

During manufacturing, these parts may go unnoticed, increasing failures, scrap, and rework rates. This impacts overall profitability and causes severe consequences in high-reliability applications. It is crucial to identify counterfeit electronic components by performing some industry-specific tests. Several norms and guidelines are issued for manufacturers and suppliers to establish and maintain product traceability. By adhering to all these practices, it is possible to produce authentic products.

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What are counterfeit electronic components?

Counterfeit electronic components are pseudo/unauthentic parts that are misrepresented in terms of their source or quality. Counterfeiting involves passing off low-quality components as high-quality by altering part numbers, repackaging, or mixing with better-quality parts.

Typical counterfeit components:

1. Originate from an unauthorized source
2. Are produced by unauthorized contractors and not by OCMs (original component manufacturers)
3. Violate original OCM design, model, and performance specifications
4. Are defective items sold as new
5. Have incorrect documentation

Classes of counterfeit parts

The production, sourcing, and distribution of counterfeit components take many forms. We will discuss the classification of such parts below:

Replication/Cloning

Cloning is the process that involves the manufacturing of reverse-engineered equipment matching with the original in terms of fit, use, and structure. The products are manufactured with low-grade equipment. Hence, they will not meet the desired reliability requirements. These devices are labeled and distributed as OCM parts.

Scrapping

During manufacturing, defective devices are sent to recyclers to recover valuable metals. Recyclers can certify destruction without scrapping the equipment and later add them back to the supply chain.

Skimming

Skimming is a type of fraud that involves overproducing or declaring a low production yield. It leads to the sale of excess devices through broker chains.

Sample devices are put back in the supply chain

OEMs and OCMs test, qualify, and certify large quantities of devices. The end-of-life evaluation process includes acceleration testing to determine the performance and reliability of the product. Specimens/samples and stolen components can be sold back into the supply chain as brand-new products. Most scrap units may still work after scrapping, making them a principal target for fraudsters.

Recreation

High-performance parts require stringent testing for applications like automotive, space, avionics, etc. But fraudsters procure lower specifications components for these applications. Later, they re-mark and resell those parts at a high price. Printed circuit boards play a significant role in the automotive sector. See our post on automotive PCB: The chassis of the modern automotive industry for a better understanding.

Suggested reading:
10 Questions You Should to Know about Calcium carbide powder

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Recovery and reuse

Many electronic appliances contain several working devices while scrapping. It is possible to recover valuable parts for reuse from these devices. The improper removal of components damages their original performance, reliability, and durability. Later, the supply chain markets these parts.

Embedded malicious software

Counterfeiters often reprogram some programmable devices that cause potential damage to products. This reprogramming is hazardous, especially in class 3 products such as military, aerospace boards, etc. It risks the safety and security of the system as well as its users. The malicious software hampers almost all the embedded servers, resulting in critical consequences.

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How to identify fake electronic parts

Here, we will discuss several test methods that are available to identify fake electronic parts. Every manufacturer should employ such techniques to avoid the use of counterfeit parts.

Visual examination

Checking for counterfeits begins with a visual inspection. This involves checking the part number present on the component against shipping documentation. The validity of the date code is examined using the previous data and past products bought from the supplier. There are some other aspects of visual checking, which are as follows:

• Fraudsters use blacktopping to put a different part number and date code on the component. It involves applying a thin black epoxy coating on the top of the part and roughening the surface to achieve the desired texture. It also comprises matching the font with the original. To identify the presence of blacktopping, the top of the component and surface texture examination is important. Along with that, it is necessary to compare the manufacturer’s symbols with a known authentic product.
• The leads of the component should be checked for damage, re-tinning, etc. This is a part of the incoming inspection.
• Other factors to consider in a device are component orientation, general appearance, contact conditions, and inconsistencies visible to the naked eye.

Electrical testing

Electrical testing for counterfeit electronic components involves validation of resistance and capacitance values along with full-functional analysis of active parts. Various contract manufacturers (CM) and third-party test labs have facilities for conducting E-tests. For testing the complex product, expensive test setup and programming expertise are essential, which is only possible at OCM or some third-party labs.

To learn more about E-test on populated boards, refer to our post on how flying probe testing works for PCB assembly.

X-ray inspection

X-ray inspection examines the hidden/internal properties of the component. Having a golden standard or a good known example is always beneficial for comparison. This method checks and verifies physical dimensions, lead frames, and bond wires. Moreover, it also examines all the components for any internal variations.

Inspections assure a defect-free product. See our post on the PCB assembly inspection report to gain insight into the various inspection tests performed on the board.

XRF technique

XRF stands for X-ray fluorescence spectroscopy. This technique determines the elemental composition of the materials and is best for verifying RoHS compliance.

Decapping

Decapping, also known as decapsulation, is the process that removes the protective cover of an IC for inspecting the micro-circuitry embedded on the underlying die. This method uses an acidic solution to etch an opening on the top of the plastic component to reveal internal semiconductor chips and bond wires. This allows for an accurate examination of photographic documentation, including fab line ID numbers and symbols.

Scanning acoustic microscope

Another method to discover blacktopping is a scanning acoustic microscope (SAM). This test locates laser etching underneath the blacktopping. If the etching is found,  it is evident that resurfacing is done to cover the original marking. This method is non-destructive. Hence, if the component passes this test, it becomes usable.

Permanency marking test

This test investigates the resistance of part markings to solvents. For counterfeit detection, it is not a reliable test since most counterfeit markings are invisible to this process. This technique works well with ceramic semiconductors and checks whether a military-grade part marking complies with the standard. For more on mil-spec boards, refer to military-grade PCB design rules and considerations.

Scrap test

Nowadays, counterfeiters are becoming aware of the acetone method for revealing blacktopping. Therefore, they have started using a different material that is resistant to acetone. As a result, the scrap test was discovered. This process uses a sharp blade to scrape the surface. If it leaves a scar or burns on the surface without flaking (peeling or cracking), then the surface is considered authentic. However, if the flaking is visible, then the part is considered as remarked or reworked. In some cases, the previous marking also becomes noticeable on the component.

Read our post on common errors encountered in discrete components to avoid malfunctions that can occur during assembly.

What are the most common attributes to recognize counterfeit parts?

It is hard to recognize counterfeit parts as a whole. However, some common attributes will help us to distinguish between genuine and non-genuine parts.

Texture

The surface texture is a crucial factor for determining counterfeit components. The texture should be smooth and consistent. If it is rough and inconsistent, then it’s considered modified. Here is an example of laser burn and grain structure inconsistency in the marking.

Another thing to observe is the mold marks. Usually, mold marks should be smooth. But after alteration, they look grainy or contaminated.

Mold marks will not occur on all parts, and some of them may appear to be textured. It will depend on the manufacturer and the part number. There is one more factor that proves the resurfacing. Generally, the top and bottom parts of the component will have the same texture since they develop due to the coating or the molding of the organic material. But if it differs, then the component is said to be compromised.

The high-magnification test inspects surface texture. Items are visible and easily recognizable during this inspection.

Marking

Observing the part marking is beneficial for identifying counterfeit electronic components in some instances. The quality of the original part marking will be good, but the quality of remarking will be poor. The logo also does not match the original standard.

Sometimes, the letters or digits repeat in part marking. Different fonts, irregular alignments, and variable sizes display indications of remarking. In the following image, the size of the two “C” is different, and the bottom line size is different than the other lines.

Part remarking is also determined by comparing the samples having the same date code and lot code. The orientation of the part marking and bars is different in the following image.

Conditions of the contacts are a significant factor in recognizing counterfeiting. The leads should be straight, and the distance between them should be equal. Observing the marks on the leads is essential to decide if they are the result of the normal tooling, insertion, or previous usage. Some flip chips consist of balls having test indentions formed as a result of factory testing. The packages having deformed balls signify re-balling. Additionally, scratches, contamination, irregular plating, and corrosion are the factors that show counterfeiting.

Generally, at the tips of the leads, there is a presence of copper where the lead was formed. If there is no presence of copper, then it shows the re-tinning.

It is also possible to have damaged leads as a result of mishandling or shipping. In that case, those parts are not forged. There should be proper documentation to trace any such abnormalities occurring on the component.

Dimensions

Comparing the physical dimensions of the part with the datasheet specifications also detects counterfeit parts. This includes using a micrometer or other measuring instrument to check the dimensions. The thickness of the part will be discrepant with the datasheet due to reworking.

Blacktopping

Blacktopping refers to the coating that covers the area, which is removed by sanding or through any other method for employing a new part number. It is inspected by acetone test. If the acetone removes this coating, then the parts are said to be unauthentic. The following observations will indicate whether the part has been remarked:

• Change in the surface texture
• Irregularities
• Elimination of the black ink
• Visible previous markings

How to avoid counterfeit electronic components

It is crucial to find ways to avoid counterfeit electronic components as they impact the overall functionality of the product. In this section, we will discuss the measures to avoid them.

Ensure the integrity of the procurement sources

Buying parts from reliable sources reduces the risk of forgery. One way to ensure integrity is to buy the parts from original component manufacturers. It is unlikely to get a tampered component from them. Even then, it’s possible to choose a reliable OCM to get high-quality parts. Another option is to select authorized suppliers that are linked with OCMs. They guarantee efficient components.

Inspection of incoming quality

In-house quality inspection enhances counterfeit electronics detection capabilities and reduces the use of low-quality parts. Inspections should verify specs, identify duplication, and perform electrical tests to ensure the functionality of the parts. The use of random checks will reduce the number of fakes that make it into the board assembly line.

Collaboration with third parties

An easy way to avoid counterfeit components is to hire a third-party company to examine parts. The service will include a thorough inspection. However, hiring an outside company will incur additional costs. They should have a reliable quality management system in place that adheres to ISO :. Furthermore, this company should be accessible and transparent about its processes and provide information and customer service.

Managing obsolescence

Implementing obsolescence management practices is another way to prevent counterfeit electronic components. The goal is to identify the outdated parts and design a plan to update equipment proactively. Whenever companies need an obsolete part, they turn to independent distributors. These unauthorized suppliers pose a higher risk of receiving counterfeit components. Obsolescence management helps companies eliminate fake parts and improve equipment efficiency.

Effective component management is key to avoiding part obsolescence, counterfeit parts, and ensuring reliable sourcing. For more, see how designers benefit from PCB component management services.

If you have any further questions about the counterfeit electronic components, please let us know in the comments section. To understand PCB assembly aspects for a better design, download our design guide.

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